Skip to content

Latest commit

 

History

History
141 lines (105 loc) · 8.12 KB

STATUS.md

File metadata and controls

141 lines (105 loc) · 8.12 KB

STATUS.md -- t27 Readiness Levels

Position in TRI-NET line: t27 is the spec-to-RTL toolchain and numeric format registry. Sibling chip repositories (separate repos):

  • tt-trinity-phi -- 1x1 phi-anchor proof / identity chip
  • tt-trinity-euler -- 8x2 e-engine safety / control engine
  • tt-trinity-gamma -- 8x4 gamma-surface 32-PE ternary mesh

See LINEUP.md for the four-product map, and FORMAT_REGISTRY.md for the numeric SSOT shared across the line.

This document records what t27 has actually shipped, at what readiness level, with conservative wording. Sources are limited to this repository's own evidence (specs, generated files, seals, conformance vectors, CI logs). Claims about external chip repositories are deliberately omitted here; cross to those repos for their own STATUS.


1. Readiness levels (definitions)

t27 uses a six-level scale for any artifact that targets silicon. Each level is a strict superset of the levels below it.

Level Meaning
SPEC A .t27 specification exists, parses, has test / invariant / bench per L4 TESTABILITY.
RTL Verilog generated under gen/verilog/ (or fpga/vivado/ hand-built blocks), produced from a .t27 spec.
SIM Logic simulation passes (Verilator / Icarus / Yosys check), with conformance vectors when applicable.
SYNTH Synthesis to a real cell library passes (Yosys synth_xilinx or equivalent), no latches, timing reported.
GDS/TAPEOUT Layout closed, DRC/LVS clean, tape-out submission made (e.g. Tiny Tapeout shuttle). Repo-local proof only.
SILICON Physical die received and bring-up reported in writing. Asserted only on direct device evidence.

A component at level N is not claimed at level N+1 without textual evidence in this repo. When in doubt, the level is lowered, not raised.


2. Component status (this repo)

2.1 Compiler and toolchain

Component Level Evidence
bootstrap/ (Stage-0 Rust) SPEC+ bootstrap/stage0/FROZEN_HASH seal, cargo build --release documented in README.md.
t27c parse GREEN 170+ specs parse (see README "System Status" table).
t27c gen-verilog SIM 5/5 FPGA modules synthesize per README; Verilog under gen/verilog/ and fpga/vivado/.
t27c gen-zig RTL-eq Backend present under gen/zig/ for 28 modules; treated as software backend, not silicon.
t27c gen-c RTL-eq Backend present under gen/c/ for 28 modules; treated as software backend, not silicon.
t27c seal GREEN .trinity/seals/ contains many sealed artifacts (729 files at audit time).
./scripts/tri GREEN Canonical CLI wrapper, documented in README.md Quick Start.

2.2 Numeric stack (GoldenFloat family)

Format Level Evidence
GF4 SPEC specs/numeric/gf4.t27, entry in conformance/FORMAT-SPEC-001.json.
GF8 SPEC specs/numeric/gf8.t27, entry in FORMAT-SPEC-001.json.
GF12 SPEC specs/numeric/gf12.t27, entry in FORMAT-SPEC-001.json.
GF16 SIM Primary format. specs/numeric/gf16.t27, gen/verilog/numeric/gf16.v, fpga/vivado/gf16_*.v,
hand-built top-levels (gf16_top.v, gf16_matmul4x4_top.v), conformance/gf*_vectors.json.
GF20 SPEC specs/numeric/gf20.t27, entry in FORMAT-SPEC-001.json.
GF24 SPEC specs/numeric/gf24.t27, entry in FORMAT-SPEC-001.json.
GF32 SPEC specs/numeric/gf32.t27, entry in FORMAT-SPEC-001.json.
TF3 (ternary) SPEC specs/numeric/tf3.t27, generated to gen/verilog/numeric/tf3.v.

GF16 is also documented at FPGA top-level under fpga/vivado/ (Vivado-buildable top + UART + matmul testbench), which is the most advanced numeric artifact in this repository. See FORMAT_REGISTRY.md for the full bit layout and interop notes.

2.3 FPGA / RTL surface

Block Level Evidence
MAC unit (specs/fpga/mac.t27) SYNTH README: "5/5 FPGA modules synthesize" with synth_xilinx.
gf16_top.v / gf16_matmul SYNTH fpga/vivado/build.tcl, build_gf16.tcl, testbenches present.
QMTECH XC7A100T profile SYNTH Listed in README "System Status"; pins IR + XDC emitter green.
Arty A7 profile SYNTH Listed in README "System Status".
Bitstream artifact in CI SYNTH README: ".bit uploaded per PR (7-day retention)".

Tiny Tapeout tape-outs (1x1, 8x2, 8x4) live in sibling repositories and are out of scope for this document. See LINEUP.md.

2.4 Formal / proof surface

Surface Level Evidence
Coq kernel partial coq/Kernel/, coq/Theorems/, coq/IGLA/; multiple Wave* commits cite Qed counts (git log).
Phi identity (L5) GREEN conformance/FORMAT-SPEC-001.json records IEEE f64 hex + zero residual.
Sacred physics SPEC+ proofs/sacred/, proofs/trinity/, proofs/gravity/.

3. Conservative status decisions

The following decisions were made when authoring this document, in line with the rule "when in doubt, lower":

  1. No SILICON claim anywhere in t27. Silicon belongs to the chip repos, not here.
  2. No GDS/TAPEOUT claim in t27. Tape-out artifacts live in tt-trinity-* repos.
  3. GF16 marked SIM, not SYNTH-on-vendor-cells, because the Verilog evidence in this repo is Yosys-friendly + Vivado scripts; we do not assert a closed vendor flow from t27 alone.
  4. Coq surface is "partial", even though recent commits add Qed counts; an external reviewer should still audit each *.v rather than trust the aggregate.

4. How to verify

Reproducible checks from this repo only:

# Build bootstrap (Rust)
cd bootstrap && cargo build --release && cd ..

# Parse specs
./scripts/tri parse specs/numeric/gf16.t27

# Run the Rust test suite (parse / gen / seal / fixed-point)
./scripts/tri test

# Validate conformance vectors and gen headers
./scripts/tri validate-conformance
./scripts/tri validate-gen-headers

# Inspect format registry
cat conformance/FORMAT-SPEC-001.json

For RTL flow, see fpga/vivado/build.tcl and fpga/vivado/build_gf16.tcl.


5. Update policy

STATUS.md is updated only when textual evidence in this repo moves a component up or down a level. PRs that change levels must cite the file(s), seal(s), or CI run(s) that justify the change.

phi^2 + 1/phi^2 = 3 | TRINITY